88e Series

Available as: New and Remanufactured

The Rite Track 88e Track System, a Rite Track design based on the proven 88 Series platform, has evolved significantly. This new system has been enhanced to add 200mm substrate processing capability with improved contamination control, reliability, and process control.

The Rite Track 88e system has 0.35µ process capabilities on 100mm to 200mm substrates

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Cost Effective 200mm Processing
The Rite Track 88e Track System is a Rite Track design. The Rite Track 88e Track System improves on the proven 88 series system by meeting the demanding requirements of 200mm processing while maintaining ease of repair and quick size changes from 100mm to 200mm.

All 88e modules are redesigned, not just "scaled-up", to ensure optimum performance at 200mm.

 

 

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Sub Half Micron Process Control
The Rite Track 88e Track System incorporates an improved HMDS delivery system to maximize resist adhesion. Aerodynamically modeled catch cups improve coating uniformity and minimize airborne contamination. All hotplates and chill plates are specially designed to improve regulation, efficiency and uniformity, resulting in better wafer-to-wafer bake and chill repeatability at critical process steps.

The Rite Track 88e Track System provides world class process capabilities for coat, bake, and develop at an affordable price. Typical process performance exceeds the control requirements for 0.35 micron geometries.

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Lower Cost Of Ownership
Improving the overall process is only part of the story. The Rite Track 88e Track System is specifically designed to eliminate the high cost of 200mm processing. Full featured systems can be delivered at a fraction of the cost of competitive 200mm substrate, 0.35 micron process tools. The Rite Track 88e Track System also maintains high throughput with reduced wafer handling times and module overheads.

 

 

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Integrated OEMs
Rite Track has partnered with the finest OEMs, including state of the art pump and environmental enclosure manufacturers. Integration of modern temperature and humidity control systems and the most advanced photoresist pumps allows coating performance far beyond other tools in this class. OEMs, include Mykrolis, IDI, Integrated Flow Systems, Semifab, Watlow, and SMCUSA.

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88 Series

Available as: New and Remanufactured

The fully featured 88 Series is ideal for submicron manufacturing. All 88 series systems are capable of processing 3" through 150mm substrates. Wafer size change is simple and requires minutes, not hours. Silicon, GaAs, Sapphire, GGG, Lithium Niobate, thin film heads, MEMS and many other substrate types are routinely processed on 88 Series systems.

The 88 series uses an enhanced in-line robotic transfer arm between each module. Critical transfers, such as between soft bake and chill, are much more easily controlled compared to a totally random robotic system. The 88 series can be provided with enhanced handling features including ceramic transfer arms, substrate edge handling during transfer and padded transfer arms.

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86 Series

Available as: New and Remanufactured

All 86 series systems are capable of processing 2" through 150mm substrates. Wafer size change is simple and requires minutes, not hours. Silicon, GaAs, sapphire, GGG, Lithium Niobate, thin film heads, MEMS and many other substrate types are routinely processed on 86 Series systems. The 86 Series are even able to process square substrates up to 125mm on a side (180mm diagonal).

The 86 series uses a simple and very forgiving belt transfer system to reduce wafer breakage. This belted system has low transfer overhead times, resulting in high throughput on an in-line track system.